SECO Unveils Cutting-Edge Technologies at Embedded World China 2024

SECO, a leading provider of end-to-end technological solutions, is set to showcase its latest innovations at embedded world China 2024, the premier exhibition for embedded systems technologies. From June 12 to 14 at the Shanghai World Expo Exhibition and Convention Centre, visitors can experience the future of IoT and industrial innovation at Booth 230.

One of the highlights at SECO’s booth will be the display of their latest Computer-on-Module solutions, featuring next-generation processor technologies across x86 and Arm® architectures. The advanced SMARC module, SOM-SMARC-Genio700, developed in partnership with MediaTek, promises unmatched performance, energy efficiency, and connectivity options for diverse IoT applications.

In addition to Computer-on-Modules, SECO will also showcase Single-board computers like the SBC-3.5-RK3568, optimized for lightweight AI and IoT applications. The booth will also feature fanless embedded computers ideal for IIoT applications, including the Titan 300 TGL-UP3 AI, leveraging the power of Intel® Core™ and Celeron® SoCs for edge AI solutions.

Moreover, SECO will introduce visitors to their Modular Vision HMI family, offering off-the-shelf solutions based on x86 and Arm® architectures with screen sizes ranging from 7 to 15 inches and up to 4K resolution. The platform allows for application-specific customizations to meet evolving demands.

Attendees will also have the opportunity to explore Clea and StudioX, pivotal elements of SECO’s IoT and AI solutions portfolio. Clea, an open-source software suite, streamlines IoT implementations, while StudioX offers businesses a way to enhance operational efficiency and deploy innovative AI-powered services.

Join SECO at Booth 230 in Shanghai to witness firsthand how their innovative solutions can accelerate digital transformation and enhance competitive edge in the world of embedded technology and IoT.